MECHANIC NO.226 Flux Paste for BGA iPhone CPU (10cc)

The MECHANIC NO.226 flux paste is a high-performance, no-clean soldering aid specifically engineered for delicate work on BGA chips, iPhone CPU reballing, and motherboard-level repairs. Its stable composition ensures reliable results with minimal residue, ideal for professional mobile repair technicians.

Key Features:

• Model: NO.226

• Type: No-Clean Flux Paste

• Volume: 10cc syringe

• Application: Designed for BGA rework, iPhone CPU, motherboard soldering

• Viscosity: Medium to high – excellent control and placement

• Residue: Minimal, non-corrosive

• Activation: Effective with both hot air and reflow systems

• Brand: MECHANIC

Advantages:

• Ideal for iPhone logic board and CPU reballing

• Improves solder flow and wetting performance

• Reduces bridging, oxidation, and voids during rework

• Compatible with both leaded and lead-free solder

• No need for post-solder cleaning in most

Usage Instructions:

• Apply a small amount to the target solder area

• Heat using a soldering iron, hot air, or reflow station

• Store syringe in a cool, dry environment with cap sealed

Precautions:

• For professional use only

• Avoid skin and eye contact

• Use with adequate ventilation