Mechanic Super Glue Remover Agent QC-20 (20ml)

Mechanic Super Glue Remover Agent QC-20

Description: Suitable for mobile phone BGA IC chip resin sealing rubber softening and dismantlingexcept. Formulated with DuPont Chemicals. systemEnvironmentally safe formula. Can quickly soften, loose and solidifyPhenolic, epoxy, acrylic, polyurethane, siliconeGum. No damage to the mobile phone Circuit board and components How to use: When applying, use a small piece of cotton woolFully disassembled, covered on the BGA chip of the sealant, Then put the phone motherboard into a small plastic pocket and close it After 20 minutes of horizontal placement, do it again, waitAfter the sealant is softened, it is carefuly removed with a needle tool. Note: Do not touch the eyes or skin with the glue.If it is inadvertently contacted, it can be washed with water. Timely useSeal the cap to avoid the imbalance of the liquid volatilization rate.influential impact. Inside the bottleThe liquid will generate gas and be carefully opened.